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REVISIONS LTR A DESCRIPTION Add device types 03 and 04. Convert to standard military drawing format and change drawing CAGE code. Add figure 4, test circuit and switching waveforms. Inactivate device types 01 and 02 for new design. Editorial changes throughout. Update to reflect latest changes in format and requirements. Editorial changes throughout. --les DATE (YR-MO-DA) 88-12-20 APPROVED M. A. Frye
B
05-02-08
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV SHEET REV SHEET REV STATUS OF SHEETS PMIC N/A REV SHEET PREPARED BY Greg A. Pitz B 1 B 2 B 3 B 4 B 5 B 6 B 7 B 8 B 9 B 10 B 11 B 12 B 13
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE
CHECKED BY Ray Monnin APPROVED BY Michael A. Frye DRAWING APPROVAL DATE 85-05-08
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil
MICROCIRCUITS, DIGITAL, TTL, OCTAL D-TYPE TRANSPARENT LATCH, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
SIZE A SHEET
CAGE CODE
B
14933
1 OF 13
84179
DSCC FORM 2233 APR 97
5962-E139-05
1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
84179
01
R
X
Drawing number
Device type (see 1.2.1)
Case outline (see 1.2.2)
Lead finish (see 1.2.3)
1.2.1 Device type. The device type identify the circuit function as follows: Device type 01, 03 02, 04 Generic number 8282 8283 Circuit function Octal, D-type, transparent latch with 3-state outputs Octal, D-type, transparent latch with inverted 3-state outputs
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter R 3 Descriptive designator GDIP1-T20 or CDIP2-T20 CQCC1-N28 Terminals 20 28 Package style dual-in-line leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range ....................................................... Input voltage range ....................................................... Storage temperature range.............................................. Maximum power dissipation (PD) 1/ .............................. Lead temperature (soldering, 10 seconds) ..................... Thermal resistance, junction-to-case (JC) ..................... Junction temperature (TJ) ................................................ 1.4 Recommended operating conditions. Supply voltage : Device types 01 and 02 ............................................................ Device types 03 and 04 ............................................................ Minimum high level input voltage (VIH) ......................................... Maximum low level input voltage (VIL) .......................................... Case operating temperature range (TC) ........................................ Input to STB setup time t(setup) ...................................................... Input to STB hold time t(hold) .......................................................... input pulse width (tP) (Strobe) ....................................................... -0.5 V dc to +7.0 V dc -1.0 V dc at -18 mA to +5.5 V dc -65C to +150C 1W +300C See MIL-STD-1835 +175C
4.5 V dc minimum to 5.5 V dc maximum 4.75 V dc minimum to 5.25 V dc maximum 2.0 V dc 0.8 V dc -55C to +125C 0 ns minimum 25 ns minimum 15 ns minimum
_________ 1/ Maximum power dissipation is defined as VCC x ICC, and must withstand the added PD due to short-circuit test; e.g., IOS.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
2
2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 List of Standard Microcircuit Drawings. Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
3
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator "C" shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator "C" shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
4
TABLE I. Electrical performance characteristics. Conditions 1/ -55C TC +125C unless otherwise specified
Test
Symbol
Group A subgroups 1, 2, 3
Device type
Limits Min Max
Unit
High level output voltage
VOH
VCC = minimum, IOH = -5 mA
All
2.4
V
Low level output voltage
VOL
VCC = minimum, IOL = 20 mA
1, 2, 3
All
0.45
V
Input clamp voltage
VI C
VCC = minimum, IIN = -5 mA, TC = +25C
1
All
-1
V
High level input voltage
VIH
VCC = 5 V, IOH = -5 mA, CL = 300 pF VCC = 5 V, IOL = 20 mA, CL = 300 pF VCC = maximum, VIH = 5.25 V
1, 2, 3
All
2.0
V
Low level input voltage
VIL
1, 2, 3
All
0.8
V
High level input current
IIH
1, 2, 3
All
50
A
Low level input current
IIL
VCC = maximum, VIL = 0.45 V
1, 2, 3
All
-200
A
Supply current
ICC
VCC = maximum
1, 2, 3
All
160
mA
Output current, high level, outputs OFF Output current, low level, outputs OFF 2/ Functional tests
IOZH
VCC = maximum, VOH = 2.7 V
1, 2, 3
All
50
A
IOZL
VCC = maximum, VOH = 0.45 V
1, 2, 3
All
-50
A
See 4.3.1c
7
All
See footnotes at end of table
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
5
TABLE I. Electrical performance characteristics - Continued. Conditions 1/ -55C TC +125C unless otherwise specified
Test
Symbol
Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11
Device type
Limits Min Max 20 12 55 45 55 45 35 25 35 25 10 2/ 10 2/ 50 50 25 25
Unit
Transition time, low to high (from 0.8 V to 2.0 V) 2/ Transition time, high to low (from 2.0 V to 0.8 V) 2/ Propagation delay time to high level (STB to output) 3/ 4/ Propagation delay time to low level (STB to output) 3/ 4/ Propagation delay time to high level (data to output) 4/ Propagation delay time to low level (data to output) 4/ Output control ON to high level output Output control ON to low level output High level output to output control OFF Low level output to output control OFF 1/ 2/ 3/ 4/
tTLH tTHL tPLH1
CL = 300 pF 10%, RL = 78, See figure 4 VCC = 5.0 V, CL = 300 pF 10%, RL = 78, See figure 4
All All 01, 03 02, 04
ns ns ns
tPHL1
9, 10, 11
01, 03 02, 04
ns
tPLH2
9, 10, 11
01, 03 02, 04
ns
tPHL2
9, 10, 11
01, 03 02, 04
ns
tPZH tPZL tPHZ tPLZ
CL = 300 pF 10%, RL = 78, See figure 4
9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11
All All All All
ns ns ns ns
VCC = 4.5 V minimum to 5.5 V maximum for device types 01 and 02, unless otherwise specified. VCC = 4.75 V minimum to 5.25 V maximum for device types 03 and 04, unless otherwise specified. Tested only initially and after any design change. For device types 02 and 04 only, output may be momentarily invalid following the high going STB transition. Device types 02 and 04 limits shown are guaranteed by design but tested to the applicable device types 01 and 03 limits.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
6
Device type Case outlines Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
01 and 03 R 3 R Terminal symbol 1D NC 2D 1D 3D 2D 4D 3D 5D NC 6D 4D 7D 5D 8D NC 6D OE GND 7D STB NC 8Q 8D 7Q 6Q 5Q 4Q 3Q 2Q 1Q VCC ----------------OE GND
02 and 04 3 Terminal symbol 1D NC 2D 1D 3D 2D 4D 3D 5D NC 6D 4D 7D 5D 8D NC 6D OE GND 7D STB NC 8D 8Q 7Q 6Q 5Q 4Q 3Q 2Q 1Q VCC ----------------OE GND
NC STB 8Q 7Q NC 6Q 5Q NC 4Q 3Q NC 2Q 1Q VCC
NC STB 8Q 7Q NC 6Q 5Q NC 4Q 3Q NC 2Q 1Q VCC
FIGURE 1. Terminal connections.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
7
Device types 01 and 03
OUTPUT ENABLE
OE H L L L
STROBE STB X L H H
DATA D X X L H
OUTPUT Q Z Q0 L H
Device types 02 and 04
OUTPUT ENABLE
OE H L
STROBE STB X L H H
DATA D X X L H
OUTPUT
Q Z Q0 L H
L L
H L Z X
= = = =
High level (steady state) Low level (steady state) High impedance state Irrelevant
Q0 = The level of Q or Q before the indicated input conditions were established
FIGURE 2. Truth tables.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
8
FIGURE 3. Logic diagram.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
9
]
FIGURE 3. Logic diagram - Continued.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
10
AC testing: Inputs are driven at 2.4 V for a logic "1" and 0.45 V for a logic "0". Timing measurements are made at 1.5 V for both a logic "1" and "0". Input rise and fall times are measured from 0.8 V to 2.0 V and are driven at 5 ns 2 ns.
FIGURE 4. Test circuit and switching waveforms.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
11
4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer.
TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) --1*, 2, 3, 9 1, 2, 3, 7, 9, 10, 11 2, 8A, 10
Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) * PDA applies to subgroup 1.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. b. c. Tests shall be as specified in table II herein. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. Subgroup 7 shall include verification of the truth table.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
12
4.3.2 Groups C and D inspections. a. b. End-point electrical parameters shall be as specified in table II herein. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. TA = +125C, minimum. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
(2) (3)
5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234 APR 97
SIZE
A
REVISION LEVEL
84179
SHEET
B
13
STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 05-02-08 Approved sources of supply for SMD 84179 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard microcircuit drawing PIN 1/ 8417901RA 84179013A 8417902RA 84179023A 84179023C 8417903RA 84179033A 84179033C 8417904RA 84179043A
Vendor CAGE number 3/ 3/ 3/ 58625 3/ 58625 58625 3/ 58625 3/ 58625 58625 3/ 58625 3/
Vendor similar PIN 2/ MD8282 MR8282 MD8283 IL8283/BRA MR8283 IL8283/B3A IL8283/B3C MD8282/B IL8282/BRA MR8282/B IL8282/B3A IL8282/B3C MD8283/B IL8283/BRA MR8283/B
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply.
Vendor CAGE number
Vendor name and address
58625
Lansdale Semiconductor Inc. 2929 South 48th St. Tempe, AZ 85282
The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.

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